Raspberry PI 1-3 Enclosure

Compact enclosure for Raspberry PI. It support RPI from 1B+ to 3B+ and provide space for a 35*35 heatsink.

v2.0.0

This enclosure is designed to be sleek and minimalistic. It is designed to be 3D printed. This case does not provide any camera or display port access. But GPIO are easily accessibles.

HDMI side view"

“USB side view”

Compatibility

This enclosure support following boards:

Raspberry PI 1B+
Raspberry PI 2B
Raspberry PI 2B 1.2
Raspberry PI 3B
Raspberry PI 3B+

Files

Two versions of the upper part are available. One with GPIO access and one without. Ideal for a clean look or server applications like VPN, DNS…

Lower part

File: RPI_3bplus_enclosure_lower_1.2.STL Lower part of the enclosure common to all

Upper part GPIO

File: RPI_3bplus_enclosure_upper_1.2.STL Orginal upper part of the enclosure with GPIO access

Upper part without GPIO

File: RPI_3bplus_enclosure_upper_1.2_no_gpio.STL Upper part of the enclosure without GPIO access

GPIO Cover

File: gpio_cover.STL Cover for GPIO. Best of both worlds, clean look and easy access to GPIO

Thermal management

This enclosure is designed to be used with passive cooling solution.

A 1mm copper plate between the CPU and the heatsink is needed to allow space for surrounding components.

Material and print settings

Clearance is 0.2mm for all parts to facilitate assembly. No support is needed.

Screws are no longer needed

Photos

Version 1.0 without clearance for SD card removal

Printing settings:

3D printer: Zortrax M200+
Material: Z-PLA Pro
Nozzle diameter: 0.4mm
High quality
Layer height: 0.09mm
Infill: 20%
No support

“Run button hole above jack connector” — Run button hole above jack connector

“Little issue with the GPIO border, was to tight. fixed.” — Little issue with the GPIO border, was to tight. fixed.

“Kapton tape is used to isolate heatsink from the board.” — Kapton tape is used to isolate heatsink from the board.

Last updated on February 3, 2024

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